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UV Release Dicing Tape PO Film for MLCC Ceramic Sheet Cutting, Wafer Grinding, LED, Semiconductor
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Product: Views:198UV Release Dicing Tape PO Film for MLCC Ceramic Sheet Cutting, Wafer Grinding, LED, Semiconductor 
Unit price: Negotiable
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Delivery date: Since the payment date Days delivery
Valid until: Long-term effective
Last updated: 2017-12-29 23:17
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Model Number: UPT152 Key Specifications/Special Features: Total thickness: 170umPO film, backing thickness: 150um, 207 PSA adhesiveMLCC cutting process Adhesion (before UV radiation) 1.11kg/inch, adhesion (after UV radiation) 20g/inchTack: 10 (ball/no)Peel off forces: 5g/inch Shipping Information: FOB Port: Taiwan
Main Export Markets:
  • Mid East/Africa
  • North America
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